孙凤莲 李文鹏 潘振

摘 要：为了研究不同Cu/Sn比对复合微焊点IMC-Cu界面生长行为的影响，采用瞬态液相连接技术与热压焊相结合的方法，以泡沫铜、纯Sn和Cu基板为原料，制备IMC-Cu复合微焊点研究不同Cu/Sn比对复合微焊点IMC生长行为影响。结果表明： Cu/Sn比对复合焊点中IMC生长行为影响显著。随着焊点中Sn含量的减少，IMC的生长速度增加。降低复合微焊点中Sn含量有利于反应界面处Cu3Sn的生长;获得全Cu3Sn-Cu复合微焊点的时间随焊点中Sn含量降低而减少。在相同焊接条件下，Sn质量分数为20%的微焊点在焊接25min时率先生成全Cu3Sn接头，较Sn质量分数为40%时焊接时间缩短了20%。当ω（Sn）在20%～40%范围内，随焊点中Sn含量减少，Cu3Sn的生长速度增加，获得全Cu3Sn-Cu复合微焊点的时间缩短。

关键词：IMC-Cu復合微焊点;泡沫铜;Cu/Sn比;微观组织

DOI：10.15938/j.jhust.2021.06.017

中图分类号： TG425.1

文献标志码： A

文章编号： 1007-2683（2021）06-0124-07

The Correlation Between Cu/Sn Ratios and the Formation Speed

of IMC-Cu Composite Micro Solder Joints

SUN Feng-lian， LI Wen-peng， PAN Zhen

（School of Material Science and Engineering， Harbin University of Science and Technology， Harbin 150080，China）

Abstract：In order to study the effect of different Cu/Sn ratios on the IMC-Cu interface behavior of composite micro solder joints， this article uses a combination of Transient Liquid Phase Welding and pressure，using foamed copper， pure Sn and Cu substrates as raw materials to prepare IMC-Cu composite micro solder joints.The effect of different Cu/Sn ratio on the growth behavior of composite micro solder joint IMC was studied.The results show that the ratio of Cu/Sn has a significant effect on the growth behavior of IMC in composite solder joints.As the Cu content in the solder joint increases， the growth rate of the overall thickness of the IMC increases.Reducing the Sn content in the composite micro solder joint is beneficial to the growth of Cu3Sn at the reaction interface.The time to obtain all Cu3Sn-Cu composite micro solder joints decreases with the decrease of Sn content in the solder joints. Under the same welding conditions.when the bonding time is 25 minutes， the full Cu3Sn joint is formed first when the Sn content in the composite micro solder joint is 20%， which is 20% shorter than the bonding time when the Sn content is 40%.When the Sn content is in the range of 20%-40%， with the decrease of the Sn content in the solder joints， the growth rate of Cu3Sn increases， and the time to obtain all Cu3Sn-Cu composite micro solder joints is shortened.

Keywords：IMC-Cu composite micro solder joint; foamed copper; Cu/Sn ratio; microstructure

0 引 言

电子封装技术是一种电子设备的元器件组合的综合性技术，主要是由电子回路的电子元器件、半导体器件组成。当前，微电子封装技术正向高功率、高频、高密度发展，同时3D集成封装也随之得到广泛研究应用[1]。近年来，各国对电子集成产业的愈加重视，微电子封装材料也得到了相应地的发展[2-4]。随着时代的发展，科学技术的不断进步，微电子封装材料也经历了多次更新换代，目前，以氮化镓（GaN） 、氧化锌（ZnO） 、碳化硅（SiC） 、氮化铝（AlN）、金刚石为代表的第三代半导体新型材料凭借着他们优良的特性正被广泛研究应用。使用第三代半导体新型材料制成的高温功率器件，可以显著提升设备应用性能、减小设备体积与重量并且减少设备损耗。……