李胜利 刘洋 翁凌 王家宁 王子龙 宋伟 王暄

摘 要：为了提高聚酰亚胺（Polyimide，PI）薄膜的综合性能，使其能够在实际中进行应用。本研究通过两组对比试验研究氧化石墨烯和纳米Al2O3颗粒的添加对PI薄膜性能的影响。一组是在PI薄膜中添加质量分数分别为0%、0.5%、1%的纳米Al2O3颗粒，另一组是在质量分数为1% Al2O3/PI薄膜基础上添加质量分数分别0.2%、0.4%、0.6%、0.8%、1%的氧化石墨烯，然后分别对不同组分薄膜的热稳定性、拉伸强度、断口形貌、介电频谱、击穿场强等进行表征。研究结果表明：PI中纳米Al2O3颗粒含量的增加使薄膜在400℃以上时的热稳定性明显降低，氧化石墨烯的添加对于Al2O3/PI薄膜的热稳定性起到显著改善的效果;适量氧化石墨烯的添加有助于复合薄膜力学性能的提升;氧化石墨烯的添加使复合薄膜介电常数增大，但对薄膜的电导率影响较小。薄膜介电损耗正切值随氧化石墨烯含量的增大先减小后增加，在氧化石墨烯质量分数为0.6%时最小。此外，氧化石墨烯的添加对Al2O3/PI薄膜的击穿场强起到显著提升的效果。

关键词：聚酰亚胺薄膜;氧化石墨烯;复合薄膜;抗拉强度;介电性能

DOI：10.15938/j.jhust.2020.01.020

中图分类号： TQ316.1

文献标志码： A

文章编号： 1007-2683（2020）01-0134-06

Abstract：In order to improve the comprehensive performance of Polyimide（PI） film in practice， the comparison tests were conducted to study the effects of graphene oxide and Al2O3 nanoparticles on the performance of PI films. One group added Al2O3 particles with mass fractions of 0%， 0.5%， and 1% to the PI film. The other group added graphene oxide with mass fractions of 0.2%， 0.4%， 0.6%， 0.8%， and 1% to the 1% Al2O3/PI film. The thermal stability， tensile strength， fracture morphology， dielectric spectrum， and breakdown field strength of the different composition films were characterized. The results show that the increase of Al2O3 nanoparticle content in PI leads to a significant decrease in the thermal stability of the film above 400 °C. The addition of graphene oxide can significantly improve the thermal stability of Al2O3/PI film. The addition of γ-Al2O3 can increase the mechanical properties of the composite film. The addition of graphene oxide increases the dielectric constant of the composite film， but has little effect on the electrical conductivity of the film. The dielectric loss tangent of the film decreases first and then increases with the increase of graphene oxide content， and it is the smallest when the graphene oxide mass fraction is 0.6%. In addition， the addition of graphene oxide significantly improves the breakdown field strength of the Al2O3/PI film.

Keywords：polyimide film; graphene; composite films; tensile strength; dielectric properties

0 引 言

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