基于分区独立温度控制的探针台卡盘温度均匀性研究
2018-08-21刘洪苏中刘宁
刘洪 苏中 刘宁



摘 要: 在半导体测试的高低温测试中需要有效地保证探针台卡盘表面温度的均匀性。利用基于有限元方法的仿真软件ANSYS Workbench对探针台卡盘冷却层进行建模,研究表面温度场分布情况。同时,对探针台卡盘表面各区域进行温度测试获取探针台卡盘温度分布。仿真结果和实验结果一致,表明探针台卡盘表面中心位置温度最高,距离卡盘中心位置距离越远,温度越低。基于现有探针台卡盘均匀加热下表面温度分布的状况,提出加热板实施分区独立温度控制,从而改善探针台卡盘表面温度的均匀性,提高探针台高低温测试的精确性。
关键词: 探针台; 有限元方法; 均匀性; 分区控制; 半导体; 温度测试
中图分类号: TN876?34; TP23 文献标识码: A 文章编号: 1004?373X(2018)16?0013?04
Abstract: During the high?low temperature test of the semiconductor, the temperature uniformity for the chuck surface of the probe station must be guaranteed. The finite element method based simulation software ANSYS Workbench is used to build the model for the chuck cooling layer of the probe station, so as to conduct research on distribution of surface temperature fields. Temperature test is performed for each area of the chuck surface of the probe station, so as to obtain the temperature distribution for the chuck of the probe station. The simulation result, in consistency with the experimental result, shows that the temperature at the central position of the chuck surface of the probe station is the highest, and the further the position from the central point of the chuck is, the lower the temperature becomes. On the basis of the surface temperature distribution after uniform heating of the current chuck of the probe station, the partition independent temperature control of the heating panel is proposed, so as to improve the temperature uniformity of the chuck surface of the probe station and accuracy of the high?low temperature test of the probe station.
Keywords: probe station; finite element method; uniformity; partition control; semiconductor; temperature test
0 引 言
探针台测试台作为接触式测试探针台,依靠探针触点与芯片电极之间的机械接触实现测试器件与被测器件之间的机?电连接,从而完成对器件的电参数和逻辑功能测试[1]。在半导体和敏感元件的功能参数和工艺测试、失效分析及可靠性试验中,对器件进行高、低温测试已是必不可少的检测条件[2]。如果探针台卡盘在进行高低温测试时温度分布不均匀,则会造成探针台测试结果的误判和漏判。姚杰等对IMD膜片加热均匀性进行了研究[3],提出对加热板实施分区独立温度控制,从而改善膜片加热温度的均匀性。杨宁等通过对ALD反应腔采取分区加热的方法[4],使用具有抗积分饱和功能的PID控制器,加上前馈补偿PID控制算法,很好地解决了反应腔内温度均匀性问题。……
