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一种用于集成天线封装(AiP)的低剖面、低成本的毫米波微带天线设计

2017-10-12汪鑫王启东曹立强

现代电子技术 2017年19期

汪鑫+王启东++曹立强

摘 要: 讨论了毫米波微带天线的工作原理、结构及其与射频前端的集成。介绍了基于CST STUDIO SUITE 2014软件设计中心频率为27 GHz微带天线的整个设计流程。设计了以Rogers 5880有机基板为介质材料的27 GHz毫米波微带天线,相对于以LTCC为介质的天线拥有低成本、低剖面的优点。提出一种毫米波微带天线与射频前端的集成方案,建立了天线与帯通滤波器仿真模型并提取[S]参数。论证毫米波微带天线与射频前端集成的可行性。所设计的微带天线尺寸只有3.8 mm×3.5 mm,天线的增益达到了7.62 dBi,辐射效率高达93%,相对带宽为2.3%,且实测值与仿真值吻合得很好,验证了设计的正确性。

关键词: 毫米波; 微带天线; 系统集成; 辐射效率

中圖分类号: TN82?34 文献标识码: A 文章编号: 1004?373X(2017)19?0001?05

Design of a low?profile and low?cost millimeter?wave microstrip antenna

for antenna?in?package (AiP) integration

WANG Xin1, 2, WANG Qidong1, 2, CAO Liqiang1, 2

(1. Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China; 2. National Center for Advanced Packaging Co., Ltd., Wuxi 214135, China)

Abstract: The working principle and structure of millimeter?wave microstrip antenna and its integration with RF front?end are discussed. The whole design process of the microstrip antenna (whose center frequency is 27 GHz) based on CST STUDIO SUITE 2014 software is introduced. The millimeter?wave microstrip antenna working at 27 GHz was design, in which the Rogers 5880 organic substrate is utilized as the dielectric material. It has the advantages of low cost and low profile in comparison with the antenna taking LTCC as its dielectric. An integration scheme for millimeter?wave microstrip antenna and RF front?end is presented. The simulation model of the antenna and band?pass filter (BPF) is established, and the [S]?parameter is extracted. The feasibility of the integration for millimeter?wave microstrip antenna and RF front?end is discussed. The size of the designed microstrip antenna is only 3.8 mm×3.5 mm, the gain of the antenna can reach up to 7.62 dBi, the radiation efficiency can reach up to 93%, and the relative bandwidth is 2.3%. The measured results are in good agreement with the simulation values, which can verify the validity of the design.

Keywords: millimeter wave; microstrip antenna; system integration; radiation efficiency

0 引 言

为了实现海量的数据传输和弥补匮乏的可用频谱,提高载波频率是必然的解决方案。因此,毫米波技术(3~300 GHz)有可观的商业前景[1],作为无线通信系统的一个重要环节,毫米波天线也成为国内外一个研究热点。微带贴片天线具有低剖面的平面结构,便于共形,制造简单,成本低,有相对较高的增益且易于安装到主机和集成到微波电路[2]。通过选择特定的贴片形状和馈电方式可以获得所需的谐振频率、极化、模式、阻抗[3?4]。在通信、雷达、医疗器械等领域有广阔的应用前景。微带天线已经大量应用在100 MHz~300 GHz频段上。在无线系统小型化中,天线封装(AiP)已经占据很重要的位置且是重要的发展方向,AiP被认为是在毫米波高速短距离无线系统中最有前景的天线解决方案。……

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