李俊衡

[中图分类号] F426.61

[文献标志码]A

[文章编号]2095-6487 （2021） 02-0059-03

Application of Project Management Theory in the Development

of Microelectronic Packaging and Testing Equipment

Li Jun-heng

[ Abstract]

At presem， the world economy is developing in the direction ofintegration. Afier my country became a member of WTO， the markeleconomy system has been continuously developed and unproved. It has continuously accelerated the speed ofintegrating with the world and is in thestage of economic development. The project management concept was introduced. Because the project management ideas introduced by enterprises曲the management stage are innovative and modern， Chinese enterprises have gradually applied them. Through the improvement of project managemenllevel， modern enterprises can be better developed. Taking the development of microelectronic packaging and testing equipment as an example， the projeclmanagement and its various management actwities are introduced from the aspects of current situation and content， hoping to provide modern enterpriseswith scientific project management methods， so as to promote the standardization and efficiency of enterprises. management

[ Keywords] project management; development of microelectronic packaging and testing equipment; cost management; time management; riskmaximization

由于現阶段国际上对中国半导体领域实施多种技术封锁和设备禁运等攻策，导致中国在芯片制造、微电子芯片封装测试等半导体领域发展举步维艰，但正因如此，国家扶持、自我发展成为我国首要任务之一。目前在微电子器件制造领域人部分工艺还依赖进口设备，所以要想摆脱国外技术限制，发展真正的中国芯，从设备的研制开发开始就要逐步国产化。

微电子封装测试通常指将切割好的芯片进行贴片、互连、密封、测试，最终形成独立器件或模块的过程，其中最主要的两个工艺过程就是贴片（Die Bond）和引线键合（Wire Bond），分别用到贴片机和键合机。

随着各个行业的不断发展，越来越多的企业将公司业务划分为一个个项目，项目成为了发展企业经济和国民经济的基本单位，能够为企业或是国家提供强有力的支撑。作为新兴的项目管理学科来说，其已经在全球各个行业得到了普遍应用，并取得了显著成效。

1 项目管理应用现状

随着半导体技术的不断发展，半导体器件在逐步往微型化、集成化的方向发展，为了摩尔定律的延续，相关行业的企业需要通过不断努力来满足市场需求，并应于不同的挑战，因此，需要考虑管理方法的创新，可采取的其中一种方法就是项目管理，在制造微电子封装测试设备的企业中，引入这一方法能够使企业的项目和组织文化得到良好的执行和改善。为了良……