低膨胀系数环氧胶粘剂的制备与性能研究
2021-04-27魏运召赵汉清马寒冰吴健伟付刚段恒范王冠王雪松蒋丽萍
魏运召 赵汉清 马寒冰 吴健伟 付刚 段恒范 王冠 王雪松 蒋丽萍



摘 要:文章设计选用低膨胀环氧树脂和固化剂为胶粘剂主体成分,研究了CTBN、核壳粒子增韧剂、超细钨酸锆填料对粘接性和膨胀性的影响,分析测定了低膨胀胶粘剂的粘度特性、物理性能、粘接性能和热膨胀特性。结果表明, CTBN能显著提高胶粘剂韧性,但热膨胀系数(CTE)显著升高,而核壳粒子增韧剂在提高剥离韧性同时, CTE无显著升高。超细钨酸锆填料能大幅降低环氧胶粘剂的CTE。制备的低膨胀环氧胶粘剂固化后剪切强度17.4MPa,玻璃化转变温度以下CTE在12.1ppm/ ℃,具有良好的耐温度循环和湿热老化性能。
关键词:低膨胀;环氧胶粘剂;钨酸锆;核壳粒子
中图分类号:TQ433.4+37 文献标识码:A 文章编号:1001-5922(2021)08-0013-04
Study on Preparation and Properties of Epoxy Adhesive with Low Thermal Expansion Coefficient
Wei Yunzhao1, Zhao Hanqing1, Ma Hanbing3, Wu Jianwei1,2, Fu Gang1,2, Duan Hengfan1, Wang Guan1,2, Wang Xuesong1, Jiang Liping1
(1.Institute of Petrochemistry, Heilongjiang Academy of Sciences, Harbin 150040, China; 2.Institute of Advanced Technology, Heilongjiang Academy of Sciences, Harbin 150020, China; 3. Southwest University of Science and Technology, Mianyang 621010, China)
Abstract:In this paper, low-expansion epoxy resin and curing agent were selected as the main components of the adhesive, and the influences of CTBN, core-shell particle toughening agent, and ultrafine zirconium tungstate filler on the adhesion and expansion were studied. The viscosity characteristics, physical, bonding, and thermal expansion properties of the low expansion adhesive were analyzed and measured. The results showed that CTBN can significantly improve the toughness of the adhesive, but the thermal expansion coefficient (CTE) was significantly increased. The core-shell particle toughening agent can improve the peel toughness, but the CTE was not markedly increased. The CTE of epoxy adhesive can be greatly reduced by ultrafine zirconium tungstate filler. The low expansion epoxy adhesive has a shear strength of 17.4MPa after curing and a CTE value of 12.1 ppm /℃ when tested below the glass transition temperature, and it has a good resistance to temperature cycle and hydrothermal ageing.
Key words:low expansion; epoxy adhesive; zirconium tungstate; core-shell particles
0 前言
環氧胶粘剂是一种工业上重要的结构胶粘剂,可适用于多种金属、塑料和复合材料的结构粘接和灌封,在航空、车辆、电子、光学等领域有着广泛应用。但通常的环氧胶粘剂的热膨胀系数较高,一般在50~75ppm/℃,在用于低膨胀系数材料如碳纤维复材、石英玻璃、铝合金等的粘接时,由于热膨胀系数的差异,在复杂温度环境如宽温域使用时容易产生内应力[1-3],影响了制件粘接强度、尺寸精度和粘接可靠性。所以在光学仪器部件、传感器、特种电机灌封、微波天线反射盘等精密部件粘接装配时,需要采用与被粘材料相匹配的低膨胀胶粘剂,以实现制件良好的尺寸精度和粘接可靠性。发达国家如美国研究了一系列低膨胀环氧胶,并形成系列化产品,如美国Bacon Industries公司的LCA系列和United Adhesive公司的EP1641系列等。……
