目录
- Study of corrective abrasive finishing for plane surfaces using magnetic abrasive finishing processes
- Investigation of the application of a magnetic abrasive finishing process using an alternating magnetic field for finishing micro-grooves
- Study on precision dicing process of SiC wafer with diamond dicing blades
- Effects of surface nanostructure on boundary lubrication using molecular dynamics
- Nanostructured grinding wheels for ultra-precision engineering applications