目录
- First-principles Calculation of Interfacial Adhesion Strength and Electromigration for the Micro-bump Interconnect of 3D Chip Stacking Packaging
- Boundary Element Analysis of Thin Anisotropic Structures by a Self-regularization Scheme
- Meshfree Method for the Topological Design of Microstructural Composites
- Analysis of Square-shaped Crack in Layered Halfspace Subject to Uniform Loading over Rectangular Surface Area
- CMES: Computer Modeling in Engineering & Sciences